MICROMODULE LIFE TEST.
Quarterly progress rept. no. 1, 17 Sep-17 Dec 64,
RADIO CORP OF AMERICA CAMBRIDGE OHIO COMMUNICATIONS SYSTEMS DIV
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Progress is reported on a micromodule life test program is to determine the Mean-Time-To-Failure MTTF of a typical analog and a typical digital micromodule when tested for ten thousand 10,000 hours under load at elevated temperature. The causes of micromodule failure during test are to be determined and reported to each supplier of test modules, and at the conclusion of testing, drift characteristics of each micromodule parameter are to be studied to determine attainable tolerance limits for these parameters. The number of failures, accumated operating time, and lower 60 confidence level of mean-time-to-failure for life testing completed during the quarter are reported.