Accession Number:

AD0611752

Title:

LEAD ATTACHMENT AND ENCAPSULATION TECHNIQUES FOR THIN FILM MICROCIRCUITS

Descriptive Note:

Corporate Author:

MITRE CORP BEDFORD MA

Personal Author(s):

Report Date:

1965-02-01

Pagination or Media Count:

20.0

Abstract:

The techniques described were developed for encapsulating experimental thin film circuits deposited on 0.5-inch square glass substrates. The encapsulation is epoxy, with final package dimensions of 0.6-inch square x . 125-inch thick. Up to 32 ribbon leads emerge, on .050 centers, arranged on the periphery of the package. A factor complicating the encapsulation was the requirement that the leads emerge on the four edges of the unit. A molding process using silicone rubber molds, and a hypodermic filling arrangement was evolved.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE