Accession Number:

AD0610956

Title:

U. S. ARMY ADVANCEMENT IN TRANSISTOR RELIABILITY THROUGH MANUFACTURING PROCESS IMPROVEMENTS,

Descriptive Note:

Corporate Author:

ARMY ELECTRONICS COMMAND FORT MONMOUTH N J

Personal Author(s):

• HAKIM,Edward B.
• Reich,Bernard

Report Date:

1964-11-01

Pagination or Media Count:

18.0

Abstract:

The report outlines transistor reliability improvements achieved by semiconductor manufacturers who incorporated improving processing techniques into their lines. These advancements were achieved under the project known as the Production Engineering Measures program for transistor reliability improvement. The procedures reported upon include the status of reliability of the particular devices used in the program in most cases the entire family of devices the methods of monitoring relative improvements and advanced techniques of specific processes such as diffusion, metalization, lead bonding, packaging, and photoresist. Author

Descriptors:

• TRANSISTORS
• PROCESSING
• DIFFUSION
• METALATION
• ELECTRIC WIRE
• BONDING
• GOLD
• ALUMINUM
• PACKAGING

Subject Categories:

Distribution Statement:

APPROVED FOR PUBLIC RELEASE