PRODUCTION ENGINEERING MEASURE TO IMPROVE PRODUCTION TECHNIQUES AND TO INSURE THE RELIABILITY OF THE C600 SERIES FIELD EFFECT TRANSISTORS.
Quarterly rept. no. 4, 1 Apr-30 Jun 64,
CRYSTALONICS INC CAMBRIDGE MASS
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Ultrasonic bonding has been discarded in preference to a new-metallization ball-bonding technique. All pro duction FETs are being die-to-header bonded using a heavy gold plate on dice and headers. A slight modification has been made in the mask design to facilitate bonding. Mesa etching fixtures and slice preparation fixtures are complete and are in use in the production process. Various experiments have been run utilizing various dew point ambients, coating agents, and bakeouts. As a result, production units are being vacuum baked at 200C. and packaged in a dry nitrogen atmosphere of -60C. dew point or better. Life test racks are being constructed. A manual of Q.C. procedures has been prepared. Author