PRODUCTION ENGINEERING MEASURE TO INCREASE THE RELIABILITY OF THE TRANSISTOR TYPE 22N2034.
Quarterly progress rept. no. 4, 1 Apr-30 Jun 64,
SILICON TRANSISTOR CORP GARDEN CITY N Y
Pagination or Media Count:
The report describes the processing developments in wafer cleaning, mesa delineation, scribing of water, pellet to nickel-plated header soldering, nickel-plated clip to pellet soldering, final etch of soldered unit, final test and encapsulation of etched units, and weld and hermetic seal tests for the transistor type 2N2034. Author