Accession Number:

AD0605679

Title:

THERMALLY CONDUCTIVE POTTING COMPOUNDS FOR 3-D WELDED ELECTRONICS,

Descriptive Note:

Corporate Author:

MASSACHUSETTS INST OF TECH CAMBRIDGE INSTRUMENTATION LAB

Personal Author(s):

Report Date:

1960-01-04

Pagination or Media Count:

8.0

Abstract:

Internal thermal considerations for handling dense electronic modules are described. These considerations lead to the development of thermally conductive potting compounds. A concluding summary sheet presents the collected data on a number of compounds analyzed. Author

Subject Categories:

Distribution Statement:

APPROVED FOR PUBLIC RELEASE