COMPONENTS PACKAGING TECHNIQUES.
Semiannual rept. for 1 Jul-31 Dec 59,
TRW SPACE TECHNOLOGY LABS LOS ANGELES CALIF
Pagination or Media Count:
This report summarizes and evaluates the present status of studies on electronic components packaging techniques described in PROJECT PLAN 165-21. These studies were conducted in four specific areas 1 design technique studies, 2 materials and processes investigations, 3 microminiaturization and mechanized production studies, and 4 environmental test and vibration studies. For the design technique studies, the test vehicle selected consists of advanced gyro and digital programming circuits which are being packaged using both conventional printed circuit and advanced techniques. In the materials and processes investigations, the limitations of foam encapsulation caused by thermal effects have been analyzed. Investigation was started of capacitance discharge techniques for welding electronic part leads into circuits. The state of the art of microminiaturization has been reviewed in a survey of work in progress at numerous organizations in the electronics industry. Sinusoidal vibration testing, commonly employed in military qualification tests, has been compared in the laboratory with random vibration equivalence data resulting from these tests are reported. The low-pressure electrical discharge study has been completed. Author