Accession Number:

AD0604901

Title:

THERMOELECTRIC JUNCTIONING PROJECT.

Descriptive Note:

Final rept.

Corporate Author:

WHIRLPOOL CORP ST JOSEPH MICH

Personal Author(s):

Report Date:

1964-07-15

Pagination or Media Count:

39.0

Abstract:

Various methods of surface cleaning the n- and p-type Peltier materials produced no difference in solderability of the materials. Also no increase in solderability was noted with the use of any specific flux tested. The acid fluxes were the easiest to work with from the standpoint of flux residues. A fairly thorough surface analysis did not reveal any surface contaminant that could be expected to inhibit solderability of the thermoelectric materials. It was discovered that antimony is a necessary constituent in the bismuth-tin solders to achieve adhesion to the as-received surfaces of the bismuthtelluride thermoelectric materials. An electrolytic nickel plating system was developed that enabled consistent and uniform nickel plating of the thermoelectric materials and resulted in good adhesion of the nickel plating to the thermoelectric materials. The nickel plated materials could be soldered with many different solders and provided a wide spectrum of possible junction operating temperatures. Author

Subject Categories:

Distribution Statement:

APPROVED FOR PUBLIC RELEASE