MINIATURE PACKAGING OF ELECTRONICS IN THREEDIMENSIONAL FORM,
MASSACHUSETTS INST OF TECH CAMBRIDGE INSTRUMENTATION LAB
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By using miniature components now available from manufacturers and a newly applied method of joining wire leads, an electronic-packaging technique based on the mounting and wiring of circuit components in a miniature three-dimensional unit mass was developed. This new technique, referred to as 3-D or High-Density Electronic Packaging, has achieved a maximum component density without sacrificing production feasibility. It consists of placing circuit elements in physical contact side by side and forming the circuit connections on a three-dimensional basis, as opposed to the two-dimensional printed-circuit board. The wires are joined by electrical-resistance spot welding, which is similar to the vacuum-tube technique. After assembly and electrical checkout, the unit is encapsulated in epoxy potting compounds to form a module. The resulting miniature package is a maximum-density assembly utilizing all practical space within the package.