Accession Number:

AD0604357

Title:

MAXIMUM DENSITY PACKAGING OF ANALOG ELECTRONICS,

Descriptive Note:

Corporate Author:

MASSACHUSETTS INST OF TECH CAMBRIDGE INSTRUMENTATION LAB

Personal Author(s):

Report Date:

1958-10-01

Pagination or Media Count:

36.0

Abstract:

Electronic packaging techniques which can be applied to subminiature electronic devices and complex systems are developed. These techniques are based on the mounting and wiring of circuit components in a threedimensional unit mass. Using the most suitable electronic circuit components now available, the Instrumentation Laboratory has achieved maximum component densities. These densities are obtained without sacrificing production feasibility. The Laboratorys packaging techniques are immediately available for use and have design flexibilities great enough to handle a variety of circuitry. Author

Subject Categories:

Distribution Statement:

APPROVED FOR PUBLIC RELEASE