Accession Number:

AD0602271

Title:

ENHANCED MICRO-MODULE INTERCONNECTIONS. AN HERMETIC PACKAGING SYSTEM FOR THE INTEGRATION OF MICRO CIRCUITS.

Descriptive Note:

Quarterly rept. no. 3, 1 Jan-31 Mar 64.

Corporate Author:

HAMILTON STANDARD WINDSOR LOCKS CONN

Personal Author(s):

Report Date:

1964-03-01

Pagination or Media Count:

66.0

Abstract:

Six engineering model design enhanced micro-modules were assembled and submitted to environmental testing thermal shock, vibration and mechanical shock. Engineering model design units were provided with microwafers with suitably shorted terminations which permit weld resistance monitoring during vibration and establishment of weld degradation, if any, after environmental testing. Several ten stage binary divider enhanced micro-modules were assembled up to the hermetic sealing step and found to be operative. Microwafers with either copper or nickel electroplated terminations were used extensively for the assembly of engineering model design and functional modules. In this type of pilot production environment it was observed that the yield with nickel terminated microwafers is considerably higher than with copper plated ones. The previously assembled machines were subjected to operational check-outs to establish compatibility with the overall process. The microwafer stack multiweld machine, as well as the can-header sealing machine, are in the process of being developed and integrated with the automatic wire programmer. Author

Subject Categories:

Distribution Statement:

APPROVED FOR PUBLIC RELEASE