Reliability evaluation of the 2N1506 transistor was conducted. This phase was in the area of internal leadbonding to metallized surfaces. The first experimental group consisted of Wedge wire bonding with aluminum wire. The second consisted of Nail-Head wire bonding with gold wire. The third and control group comprised standard production bonding wedge wire bonding with gold wire. The detailed processing and test evaluation steps are presented. The test conditions are listed. The evaluation summary for each lot by test evaluation performed is presented in tabular form.