MICROMINIATURE LAYERED PRINTED WIRING.
Final rept. no. 4, 15 Jun 62-15 Aug 63
PHOTOCIRCUITS CORP GLEN COVE N Y
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The results of work performed proved the feasibility of producing microminiature multilayered printed wiring boards with plated-through holes located on .050 inch centers. The results of tests performed on 400 samples of 3 different patterns demonstrated that such boards can withstand the environmental conditions specified and will generally meet the requirements of this specification, with certain minor exceptions or deviations. The design and processing requirements for the manufacture of such microminiature multilayer boards have been established and reflected in recommended purchasing specifications. All processes required and employed in the manufacture of such boards are within the scope of the present state of the art of the printed wiring industry and can be duplicated by any qualified manufacturer in this field. The main portion of the report is devoted to description and discussion of testing procedures and test results obtained from samples of microminiature multilayer printed wiring boards. Author