PRODUCTION ENGINEERING MEASURE TO IMPROVE PRODUCTION TECHNIQUES AND TO INSURE THE RELIABILITY OF THE C600 SERIES FIELD EFFECT TRANSISTORS.
Quarterly rept. no. 3, 1 Jan-31 Mar 64,
CRYSTALONICS INC CAMBRIDGE MASS
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Ultrasonic Bonding - Improvements have been made in wire feed and in the mount holder to facilitate bonding. In addition, slice probing has been inaugurated to increase the efficiency of the bonder. Die-To-Header Bonding - A die to header bonder has been purchased and installed. Best results have been obtained by applying the gold directly to the slice and thus eliminating the S1 O2 film. Masks and Alignment System The mask spacings have been reduced to take advantage of the improved alignment technology. This has resulted in a significant improvement in the GmIA ratio. Etching Fixture - The mesa etching fixture has been installed in the production process. Work on a slice preparation fixture is continuing. A final design of the life test racks has been made, and the first samples will be available at the end of April. Author