RESISTORS FOR MICROPOWER CIRCUITS.
Quarterly rept. no. 3, 1 Jan-31 Mar 66,
SPEER CARBON CO NIAGARA FALLS NY
Pagination or Media Count:
Micropower resistors with lead wires attached by welding have been prepared. A new ceramic substrate system is employed. Fabrication of many thousands of these substrates with a recently completed hydraulic press has been accomplished. The application of resistive pastes to these substrates has been given considerable attention, and the effects of process variables such as coating thickness and paste viscosity on resistor properties have been examined. Contact problems were encountered in some cases, and investigations of firing schedules and electroplating overlays have been initiated. Variables in the process of attachment of leads with percussive welding equipment have received some preliminary study. An improved helixing machine has been placed in operation, and initial mechanical and electrical difficulties have been eliminated. The effect of certain helixing parameters, such as nozzle to substrate distance and the effect of annealing after helixing have been investigated. Preliminary studies of encapsulation using dummy substrates have also been initiated. Author
- Electrical and Electronic Equipment