STUDY OF TRANSIENT RADIATION EFFECTS ON MICROELECTRONICS. VOLUME I: INTRODUCTION, EXPERIMENTAL STUDY, DIGITAL LOGIC GATE STUDY.
Final rept. Jan-Jul 65,
NORTRONICS NEWBURY PARK CA APPLIED RESEARCH DEPT
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The purpose was to compare microcircuits of differing construction techniques to determine their relative vulnerability, to study basic radiation-induced failure mechanisms, and to relate these mechanisms to both construction technique and circuit design. Test specimens were of three basic circuit types of five different fabrication techniques. Circuit types included digital logic gates, flip-flops, and differential or digital sense amplifiers. Fabrication techniques represented monolithic, multiple-chip, thin film compatible, oxide-isolation, and thin-film hybrid. Experimental study consisted of determining the electrical circuit performance parameters, the transient response in pulsed ionizing radiation environments, and permanent degradation from exposure to a pulsed reactor neutrongamma environment. Failure mechanisms were, when possible, related analyticall, to the characteristics of the circuit and the fabrication technique. Author
- Electrical and Electronic Equipment