ENHANCED MICRO-MODULE INTERCONNECTIONS. (AN HERMETIC PACKAGING SYSTEM FOR THE INTEGRATION OF MICRO CIRCUITS).
Quarterly rept. no. 2, 1 Oct-31 Dec 63,
HAMILTON STANDARD WINDSOR LOCKS CONN
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Effort was directed toward the evolution of previously developed processes into manufacturing techniques. In addition, electrical testing procedures were compiled and test circuits assembled and checked-out. Twenty solid-state microcircuit wafers, each provided with two integrated circuits were assembled, tested, and submitted as samples. Several microwafer stack -- header transfer wafer assemblies have been fabricated. These units are provided with microwafers with suitably shorted terminations to permit weld resistance monitoring during vibration to detect any potential open circuits. The majority of the machines required for the establishment of the pilot line have been designed and are in the process of being fabricated and assembled. A wired electronic programmer for the automatic electron beam welding of the copper ribbons and hermetic sealing of the structure has been build and successfully tested. Author