Accession Number:

AD0423958

Title:

BONDING OF FOAM PLASTICS BY MEANS OF HIGH-FREQUENCY HEATING

Descriptive Note:

Corporate Author:

REDSTONE SCIENTIFIC INFORMATION CENTER REDSTONE ARSENAL AL

Personal Author(s):

• Koval'chuk, L. M.
• Baker, Tr. by Ingeborg V.

Report Date:

1963-10-25

Pagination or Media Count:

15.0

Abstract:

The possibility of connecting bonding foam plastics by means of internal heating in a high frequency field that speeds up the process and gives a firm connection was studied. Bonding is performed as follows. On the surface of one of the parts to be bonded, a thin layer of adhesive or water is spread the parts are then compressed and placed in a high-frequency electrical field. The damp inner layer is quickly heated to 100 - 130 C, and the joined layers of foam plastic fuse and bond. During the experimental processes the characteristics of the behavior of materials during heating were studied, heating conditions and regimes were found, and dielectric properties of the foam plastic and the zones of bonded seams before and after bonding were measured.

Descriptors:

• *BONDING
• *EXPANDED PLASTICS
• POLYMERS
• STYRENE PLASTICS
• HEATING
• ADHESIVES
• POLYVINYL CHLORIDE
• HIGH FREQUENCY
• MEASUREMENT
• DIELECTRIC PROPERTIES

Subject Categories:

• Manufacturing and Industrial Engineering and Control of Production Systems

Distribution Statement:

APPROVED FOR PUBLIC RELEASE