THE EFFECTS OF DIP SOLDERING UPON VARIOUS BOARD MATERIALS AND SOLDER RESIST USED IN PRINTED CIRCUITS
FRANKFORD ARSENAL PHILADELPHIA PA
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This report describes the procedures in conducting eleven dip soldering tests to determine the effects that dip soldering at various temperatures and times has upon various printed circuit board materials, and solder resist materials. It discusses the results and conclusions of these soldering tests.
- Manufacturing and Industrial Engineering and Control of Production Systems