Accession Number:

AD0419035

Title:

THE EFFECTS OF DIP SOLDERING UPON VARIOUS BOARD MATERIALS AND SOLDER RESIST USED IN PRINTED CIRCUITS

Descriptive Note:

Corporate Author:

FRANKFORD ARSENAL PHILADELPHIA PA

Personal Author(s):

Report Date:

1963-08-01

Pagination or Media Count:

43.0

Abstract:

This report describes the procedures in conducting eleven dip soldering tests to determine the effects that dip soldering at various temperatures and times has upon various printed circuit board materials, and solder resist materials. It discusses the results and conclusions of these soldering tests.

Subject Categories:

  • Manufacturing and Industrial Engineering and Control of Production Systems

Distribution Statement:

APPROVED FOR PUBLIC RELEASE