TRACE IMPURITY EFFECTS ON GROWTH HILLOCKS DURING EPITAXIAL ELECTRODEPOSITION FROM COPPER PERCHLORATE SOLUTIONS.
Scientific rept. no. 2, June-Dec 62,
ITT FEDERAL LABS NUTLEY N J
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Growth hillocks ordinarily cover the surface of copper electrodeposits from reagent grade solutions. A 75 decrease in the number of hil locks was observed when the plating baths were purified by pre-electrolysis and oxidation. When gelatin or Pb were added in ppm or ppb concentration to the purified solutions, the surfaces of new electrodeposits were then completely covered with growth hillocks. It is concluded that the formation of surface features during electrodeposition from reagent grade solutions is affected3 the presence of trace impurities. Author