PRODUCTION ENGINEERING MEASURE, 2N914 AND 2N995.
Quarterly rept., 30 Jan-30 Apr 63,
FAIRCHILD CAMERA AND INSTRUMENT CORP MOUNTAIN VIEW CALIF FAIRCHILD SEMICONDUCTOR DIV
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Contents Lead Attach Improvement change in metal system, small ball bonding, wire study, ultrasonic bonding, and dynamic and step stress testing Preparation of substrate for epitaxial growth Improve header plating Eliminate gross particles and Improve die attach.