MICROMINIATURE INTEGRATED CIRCUIT PACKAGE
Quarterly progress rept. no. 2, 1 Oct 1962-1 Jan 1963
WESTINGHOUSE ELECTRIC CORP YOUNGWOOD PA
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Two successive design modifications were made to the graphite glassing boats in order to achieve more uniform package appearance. Fifty package samples were submitted for mechanical evaluation. Techniques for sealing the integrated circuit package were established. Improved cleaning techniques were established for deoxidizing kovar parts prior to gold plating resulting in less pitting of the metal. Stamped lead preforms received during this period. The first one hundred microminiature circuit packages submitted were fabricated with etched leads. The stamped leads are more uniform in cross section. Ceramic micromodules with pads were designed and ordered. This micromodule will be utilized to develop an integral package using the ceramic micromodule as a base.
- Electrical and Electronic Equipment