PEST REACTIONS IN INTERMETALLIC COMPOUNDS. 1. GRAIN BOUNDARY HARDENING IN NiGa.
Final rept. Feb 1962-Feb 1963
GENERAL ELECTRIC CO SCHENECTADY NY
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The phenomenon of grain boundary hardening has been explored for the CsCl structure intermetallic compound NiGa. NiGa has a homogeneity range of a few percent and it was possible to examine the effect of stoichiometry upon the grain boundary hardening due to preferential oxygen diffusion down grain boundaries. While some grain hardening was noticeable just below 50 Ga, the effect was much less pronounced than at 52 Ga. It was possible to estimate both bulk diffusion and grain boundary diffusion rates for oxygen. The results suggest that hardening is due to lattice distortions which arise from the formation of a Ga-O complex.
- Metallurgy and Metallography