Accession Number:

AD0405821

Title:

PEST REACTIONS IN INTERMETALLIC COMPOUNDS. 1. GRAIN BOUNDARY HARDENING IN NiGa.

Descriptive Note:

Final rept. Feb 1962-Feb 1963

Corporate Author:

GENERAL ELECTRIC CO SCHENECTADY NY

Personal Author(s):

Report Date:

1963-04-01

Pagination or Media Count:

47.0

Abstract:

The phenomenon of grain boundary hardening has been explored for the CsCl structure intermetallic compound NiGa. NiGa has a homogeneity range of a few percent and it was possible to examine the effect of stoichiometry upon the grain boundary hardening due to preferential oxygen diffusion down grain boundaries. While some grain hardening was noticeable just below 50 Ga, the effect was much less pronounced than at 52 Ga. It was possible to estimate both bulk diffusion and grain boundary diffusion rates for oxygen. The results suggest that hardening is due to lattice distortions which arise from the formation of a Ga-O complex.

Subject Categories:

  • Metallurgy and Metallography

Distribution Statement:

APPROVED FOR PUBLIC RELEASE