DESIGN AND EVALUATION OF THERMOELECTRIC THERMAL BARRIER FOR MICRO-MODULES
ARMY ELECTRONICS LABS FORT MONMOUTH NJ
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Use of a specific Peltier temperature control device, called a thermoelectric thermal barrier, to protect heat-sensitive electronic circuit elements from closely associated heat-producing elements in a microelectronic assembly is discussed. Test results on a simulated binary divider micro-module indicate the feasibility of the thermoelectric thermal barrier approach. Experimental results with a simulated micro module operating at temperatures between 25 C and 95 C indicate that it is possible under certain circumstances to protect a heat-sensitive element from a heat-generating element within the same micro-module by means of a small, low current Peltier device built directly into the micro module between these element.
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