PRODUCTION ENGINEERING MEASURE. DIFFUSED SEMICONDUCTOR DEVICES 7, 12 PLUS 2N559 AND 2N1094
WESTERN ELECTRIC CO INC LAURELDALE PA
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Three machines were completed The wafer breaking, screening, and loading machine and wire bonding machine no. 2 completed shop trial only platform lead welding machine no. 2 completed prove-in as well as shop trial. A clutch-brake was modified to avoid a wear problem. Wire bonding machine no. 2 attained a mechanical yield of 96 during shop trial. The piece part cleaning and the header assembling machines continued in shop trial. The parts drying problem on the piece part cleaning machine was corrected. A fouling problem was encountered on the glassing molds. It was caused by the glass slug feeding station. The card loading machine was attached to the 2N559 testing and date stamping machine and was then power driven for the first time. The closure welding machine advanced from construction. Effort was continued on the switching time modules of the data handling system. The can getter machine design was completed and construction was continued.