EFFECTS OF ELEVATED TEMPERATURE AND REDUCED ATMOSPHERIC PRESSURE ON ADHESIVES, POTTING COMPOUNDS AND SEALANTS
GENERAL DYNAMICS CORP FORT WORTH TX
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Five materials which might have specialized uses on glide and boost- glide type vehicles were evaluated under space environmental conditions of up to 700 F and reduced pressure in the order of 11000 mm Hg. Materials selected included, a Si rubber sealant, a butyl rubber cement, an epoxy room temperature curing adhesive, a phenylsilane-based adhesive, and a Viton rubber-based cement. An environment of 200 F and reduced pressure of about 11000 mm Hg for 300 hours did not significantly affect the strengths of the materials tested. Retention of adhesion of the butyl rubber cement was also satisfactory after 300 hours at 400 F and about 1.51000 mm of Hg vacuum. The Si sealant sponged at about 2.51000 mm Hg vacuum and 700 F. It is felt that this material, with slight modifications in initial cure, may exhibit improved thermal stability. Dynabond 118 retained a portion of its strength after exposure to 700 F and approximately 2.51000 Hg vacuum. Neither the Epon 931 nor the Viton rubber cement performed satisfactorily under the simulated space conditions.
- Adhesives, Seals and Binders