SILICON SEMICONDUCTOR NETWORKS MANUFACTURING METHODS
Interim technical engineering rept. Jul-Sep 1961
TEXAS INSTRUMENTS INC DALLAS
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Process techniques, manufacturing equipment designs, and assembly techniques for solid circuit semiconductor networks were established. Pilot-line equipment was constructed, evaluated, and improved. Effort was concentrated on developing and refining processes for producing single-chip, planar, oxide-protected devices with evaporated lead interconnections. Emphasis remained on doing as much processing as possible on silicon in slice form. This philosophy necessitated further refinements to ensure isolation of components. Several methods of improving isolation are described. A molecular electronic computer incorporating 587 semiconductor networks was completed and tested.
- Electrical and Electronic Equipment