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STUDIES AND SURVEYS IN THE FIELD OF PRINTED CIRCUIT BOARDS AND FOIL CLAD LAMINATES
Final rept. 1 Jul 60-30 Jun 61
LITTON INDUSTRIES VAN NUYS CA
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Results of a study covering 5 areas of interest in the evaluation of foil clad laminates used for the manufacture of printed wiring boards are reported. This study covers the design and construction of necessary testing equipment, the establishment of testing procedures, and the gathering of experimental data to provide more complete information for specification requirements for these materials. This report is divided into 5 areas of discussion as follows Allowable limits per square for nicks, pin holes and scratches on printed wiring boards Study of insulation resistance on foil clad laminates Peel strength after dip solder Peel strength at elevated temperatures and a complete evaluation of copper clad paper base epoxy laminates. Specimen preparation, testing methods, an analysis of experimental data, and where appropriate, recommended specification provisions are presented under each task. Author
APPROVED FOR PUBLIC RELEASE