Accession Number:

AD0266025

Title:

GRAIN BOUNDARY CRACKING IN METALS UNDER STRESS AT ELEVATED TEMPERATURES

Descriptive Note:

Corporate Author:

GENERAL TELEPHONE AND ELECTRONICS LABS INC BAYSIDE N Y

Personal Author(s):

Report Date:

1961-06-15

Pagination or Media Count:

1.0

Abstract:

A study was made of the effect of purification and of a number of metal and oxide additions upon the occurrence of intergranular cracking in brass, Cu, Ni, Ti and Zr under t nsion at elevated temperatur s. Purificatio by a variety of means inhibited in ergranular cracking in brass, Cu, and Ni. Zr additions also decreased the frequency of grain boundary cracks in brass and Cu, while Al2O3 additions increased the number of cracks. Under a wide variety of conditions, Ti and Zr of commercial purity were immune to grain boundary cracks and intergranular fracture. A few experiments re performed to demonstrate t e parallel effect of impurities and additions upon the nucleation of voids during diffusion the initiation of grain boundary cracks during creep the mechanism of crack nucleation by vacancy condensation is discussed Aut or

Subject Categories:

Distribution Statement:

APPROVED FOR PUBLIC RELEASE