Accession Number:

AD0262381

Title:

PRODUCTION ENGINEERING MEASURES. DIFFUSED SEMICONDUCTOR DEVICES 7, 12 PLUS 2N559 AND 2N1094

Descriptive Note:

Corporate Author:

WESTERN ELECTRIC CO INC LAURELDALE PA

Personal Author(s):

Report Date:

1961-06-10

Pagination or Media Count:

1.0

Abstract:

Mechanization of Device 12 -- The automatic wafer bonding, automatic wire bonding and dc and HF test machines were developed and used to produce the pilot units. Mechanization of 2N5592N1094 -- The Header Continuous Rack Plating, Emitter Etching and 2N559 Testing and Packaging machines were completed. The Header Assembling Machine was operated and the results indicated that the machine could be used for limited assembly of product. The 4 machines which are in various stages of construction are Universal Cleaning and Plating, Can Assembly, Testing and Packaging - 2N1094 and Data Handling. The Universal Cleaning and Plating machine module which was used as a guide was satisfactorily proved-in. The design phase of the Can Assembly machine was completed and construction was started. Author

Subject Categories:

Distribution Statement:

APPROVED FOR PUBLIC RELEASE