ULTRASONIC GRINDING TECHNIQUES IN MICROMINIATURIZATION
HARRY DIAMOND LABS ADELPHI MD
Pagination or Media Count:
Ultrasonic impact grinding techniques are shown to be extremely useful in the fabrication of microcircuit substrates and other specialty component parts. Pertinent parameters of machine operation and tool design are discussed and detailed examples of applications are given. These include the fabrication of 1 sections of glass only 0.005 in. in thickness, 2 multihole substrates, 3 Hall measurement specimens, 4 tiny toroids, and 5 spiral grooves.
- Machinery and Tools