Accession Number:

AD0258295

Title:

DEVELOPMENT OF IMPROVED THERMAL SHOCK RESISTANT DIELECTRIC MATERIALS FOR EMBEDDING ELECTRONIC COMPONENTS

Descriptive Note:

Corporate Author:

HUGHES AIRCRAFT CO CULVER CITY CALIF

Personal Author(s):

• RUST,J.B.
• BRAULT,R.G.
• FEUCHTBAUM,R.F.

Report Date:

1960-12-10

Pagination or Media Count:

1.0

Abstract:

New polyhydridosilanes have been prepared which are capable of crosslinking commercial solentless silicone resins. Disilylbenzene has been successfully added to R65 yielding a fluid product which can be used as a crosslinking agent. Gelling of silicone resins with disilylbenzene has been found to be adversely affected by air. A method has been found to minimize the adverse effects of the reaction exotherm. Results of the weight loss studies at 300 and 350 C are reported. Specimens for the high temperature dielectric measurements have been prepared and aged. Several modifications of the test jig for this analysis have been explored and the final design is being fabricated. Author

Descriptors:

• *EMBEDDING SUBSTANCES
• *SILICONE PLASTICS
• ADDITIVES
• AGING(PHYSIOLOGY)
• BENZENE
• CASTING
• DIELECTRIC PROPERTIES
• DIELECTRICS
• ELECTRONIC EQUIPMENT
• HEAT RESISTANT PLASTICS
• HIGH TEMPERATURE
• PLASTICS
• POLYMERIZATION
• POLYMERS
• SHOCK RESISTANCE
• SILANES
• SYNTHESIS
• TEMPERATURE
• THERMAL STRESSES

Subject Categories:

Distribution Statement:

APPROVED FOR PUBLIC RELEASE