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DEVELOPMENT OF IMPROVED THERMAL SHOCK RESISTANT DIELECTRIC MATERIALS FOR EMBEDDING ELECTRONIC COMPONENTS
HUGHES AIRCRAFT CO CULVER CITY CALIF
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New polyhydridosilanes have been prepared which are capable of crosslinking commercial solentless silicone resins. Disilylbenzene has been successfully added to R65 yielding a fluid product which can be used as a crosslinking agent. Gelling of silicone resins with disilylbenzene has been found to be adversely affected by air. A method has been found to minimize the adverse effects of the reaction exotherm. Results of the weight loss studies at 300 and 350 C are reported. Specimens for the high temperature dielectric measurements have been prepared and aged. Several modifications of the test jig for this analysis have been explored and the final design is being fabricated. Author
APPROVED FOR PUBLIC RELEASE