Accession Number:

AD0255753

Title:

COMMON PARALLEL THERMOCOUPLES FOR AVERAGE TEMPERATURE MEASUREMENT

Descriptive Note:

Technical rept.

Corporate Author:

AERONAUTICAL SYSTEMS DIV WRIGHT-PATTERSON AFB OH FLIGHT AND ENGINEERING TEST GROUP

Personal Author(s):

• Boggs, Bernard C.

Report Date:

1960-11-01

Pagination or Media Count:

46.0

Abstract:

The report describes the use of common parallel thermocouple circuits for temperature control in thermal simulation. Iron-constantan thermocouples were welded directly to the basic metal being heated. Structural tests at elevated temperatures show that thermocouples connected into parallel electrical circuits and grounded to a common metal sheet give the same temperature measurements as separated thermocouples connected into a parallel circuit. This method is applicable to any test situation requiring average temperatures.

Descriptors:

• *THERMOCOUPLES
• TEMPERATURE
• AIRCRAFT
• COPPER ALLOYS
• TEST METHODS
• CIRCUIT ANALYSIS
• TEMPERATURE CONTROL
• NICKEL ALLOYS
• CIRCUITS
• ELECTRICAL NETWORKS
• MEASUREMENT
• IRON

Subject Categories:

• Test Facilities, Equipment and Methods

Distribution Statement:

APPROVED FOR PUBLIC RELEASE