Accession Number:

AD0255658

Title:

LOWER COST PACKAGING FOR GUIDED MISSILE ELECTRONICS

Descriptive Note:

Corporate Author:

HARRY DIAMOND LABS ADELPHI MD

Personal Author(s):

Report Date:

1961-03-28

Pagination or Media Count:

68.0

Abstract:

A study was made of packaging techniques for guided missile electronics in which it was pointed out that the real cost of such electronic devices is not that cost required to manufacture the end product, but that cost which includes its share of the financial burden of development and production. It was shown that the over-all costs could be reduced by shortening development programs through the elimination of steps in the packaging process and by substantially reducing the effects of the environment so that less costly electronic components can be utilized. The method is dependent upon the use of 1 mounting materials with certain specific qualities to insure optimum performance of packages in several simultaneous environmental situations and, if necessary, 2 cooling fluids compatible with anticipated heat inputs and stated engineering boundaries.

Subject Categories:

  • Electrical and Electronic Equipment
  • Containers and Packaging
  • Guided Missiles

Distribution Statement:

APPROVED FOR PUBLIC RELEASE