Accession Number:

AD0252020

Title:

DEVELOPMENT PROGRAM FOR MODULAR INTERCONNECTIONS FOR MICRO-ASSEMBLIES

Descriptive Note:

Quarterly progress rept. no. 2, 30 Sep-30 Dec 60,

Corporate Author:

UNITED TECHNOLOGIES CORP WINDSOR LOCKS CT HAMILTON STANDARD DIV

Personal Author(s):

Report Date:

1960-12-30

Pagination or Media Count:

40.0

Abstract:

A 6 position fixture was made for welding wafers at one setup. A mold was made to pot wafers in stackll testing was designed and constructed. Over 200 riser wires were electron beam welded to metallized alumina wafers in order to optimize machine parameters and establish testing methods. A technique for continuousseam electron beam welding of each joint area was developed. Pull test of four. A fixture for welding riser wires to the stacked wafers on a 25 mil grid was constructed. A fixture was designed and built for the vibration test. A fixture for resistance measurements and pull testing was designed and constructed. Over 200 riser wires were electron beam welded to metallized alumina wafers in order to optimize machine parameters and establish testing methods. A technique for continuousseam electron beam welding of each joint area was developed. Pull tests were made with both wires in tensile. Other tests were made with the weld nugget in shear. The shear test method is shown to be a more reliable procedure. The electrical resistance of all welded joints was measured. A dc resistance method was used and all visually acceptable welds had a measured resistance within the requirement of SCL-7553. Author

Subject Categories:

Distribution Statement:

APPROVED FOR PUBLIC RELEASE