RECENT DEVELOPMENTS IN CASTING RESINS AND TECHNOLOGY FOR ELECTRICAL ENCAPSULATION APPLICATIONS
PLASTICS TECHNICAL EVALUATION CENTER DOVER N J
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Recent developments in plastic casting resins, processing techniques and test methods for electrical encapsulation applications are summarized. Plastic materials covered include epoxy, silicone, polysulfide, polyurethane, polyester, and hydrocarbon. Advances in electrical testing techniques have been largely due to the use of sensing devices encapsulated in the resin and the determination pf parameters both during and after resin hardening. Instrumentation has been reported for determining the existence and magnitude of thermal stresses in casting resins during and after cure the electrical properties of the resins during and after cure thermodynamic properties, such as rate of polymerization, extent of polymerization, and over-all activation energies and thermal properties, such as specific heat and second-order transition temperature. Advances in encapsulation techniques have been made in mixing and dispensing equipment, expendable molds, and kit-type packaging. The report lists resin suppliers, suppliers of formulated material, chemical structure of encapsulating resins and diluents, and 90 references from the literature. Author-PL.