Accession Number:
AD0163858
Title:
Bonding Process for Polyphenylene Oxidedielectric Microwave Circuits and Bonded Assembly.
Descriptive Note:
Patent,
Corporate Author:
OFFICE OF THE SECRETARY OF THE ARMY WASHINGTON D C
Personal Author(s):
Report Date:
1972-10-24
Pagination or Media Count:
5.0
Abstract:
The patent describes microwave striplines formed by intimately bonding circuit planes to polyphenylene oxide shield planes, heat and pressure is used in combination with an interface bonding material comprised of a polymeric resin composed of a random copolymer product of copolymerization of ethylene and acrylic acid.
Descriptors:
Subject Categories:
- Electrical and Electronic Equipment