Bonding Process for Polyphenylene Oxidedielectric Microwave Circuits and Bonded Assembly.
OFFICE OF THE SECRETARY OF THE ARMY WASHINGTON D C
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The patent describes microwave striplines formed by intimately bonding circuit planes to polyphenylene oxide shield planes, heat and pressure is used in combination with an interface bonding material comprised of a polymeric resin composed of a random copolymer product of copolymerization of ethylene and acrylic acid.
- Electrical and Electronic Equipment