Accession Number:

AD0163858

Title:

Bonding Process for Polyphenylene Oxidedielectric Microwave Circuits and Bonded Assembly.

Descriptive Note:

Patent,

Corporate Author:

OFFICE OF THE SECRETARY OF THE ARMY WASHINGTON D C

Report Date:

1972-10-24

Pagination or Media Count:

5.0

Abstract:

The patent describes microwave striplines formed by intimately bonding circuit planes to polyphenylene oxide shield planes, heat and pressure is used in combination with an interface bonding material comprised of a polymeric resin composed of a random copolymer product of copolymerization of ethylene and acrylic acid.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE