Accession Number:

AD0163681

Title:

Method of Bonding Quartz to Metal.

Descriptive Note:

Patent,

Corporate Author:

OFFICE OF THE SECRETARY OF THE ARMY WASHINGTON D C

Personal Author(s):

Report Date:

1972-04-18

Pagination or Media Count:

2.0

Abstract:

The patent describes a metallic bond formed between a quartz surface and a stainless steel surface by an electroplating method. The method includes plating a thin layer of a low stress electrically conductive metal such as nickel, gold or copper, onto a composite chromium-copper Cr-Cu film which is strongly adherent to quartz. The quartz coated surface is placed in physical and electrical contact with the stainless steel surface, and the low stress electrically conductive metal plated from a suitable plating solution onto both the quartz coated surface and the stainless steel surface.

Subject Categories:

  • Electrical and Electronic Equipment
  • Fabrication Metallurgy

Distribution Statement:

APPROVED FOR PUBLIC RELEASE