Accession Number:

AD0163628

Title:

Method and Apparatus for Joining Plated Dielectric-Form Waveguide Components.

Descriptive Note:

Patent,

Corporate Author:

OFFICE OF THE SECRETARY OF THE ARMY WASHINGTON D C

Personal Author(s):

Report Date:

1971-05-04

Pagination or Media Count:

4.0

Abstract:

The patent describes a plated dielectric waveguide component which includes a dielectric foam substrate propagating medium and a thin metallic surface encapsulating the substrate for carrying a conducting current therealong and a method of interconnecting the same. The waveguide component has a quarter wavelength step-shaped end which may be readily butt joined with another plated dielectric waveguide component having a similar construction and matching end whereby a lightweight, sturdy and highly efficient connection is obtained.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE