Accession Number:

AD0163523

Title:

Method of Making Printed Circuit Assemblies.

Descriptive Note:

Patent,

Corporate Author:

OFFICE OF THE SECRETARY OF THE ARMY WASHINGTON D C

Personal Author(s):

Report Date:

1971-01-12

Pagination or Media Count:

3.0

Abstract:

The patent is concerned with a method of making double-sided or multilayer printed circuit boards with hole-free terminal leads on one surface of the board for attachment of wire leads while providing electrical interconnection between conductive layers.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE