Accession Number : ADA556028


Title :   Micromechanical Sensor for the Spectral Decomposition of Acoustic Signals


Descriptive Note : Final rept.


Corporate Author : ARMY RESEARCH DEVELOPMENT AND ENGINEERING COMMAND REDSTONE ARSENAL AL


Personal Author(s) : Hudson, Tracy D ; Kranz, Michael S ; Holt, James C


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/a556028.pdf


Report Date : Feb 2012


Pagination or Media Count : 365


Abstract : This technical report is duplicative documentation of the approved doctorial thesis of one of the co-authors. The research was funded in part by the U.S. Army Aviation and Missile Research, Development, and Engineering Center (AMRDEC) for the development of micromechanical sensors under the Army Technology Objective (ATO) of Sensor, Warhead, and Fuzing Technology Integrated for Combined Effects (SWFTICE). Particular technical progress at AMRDEC within this report includes resonant array processing (Chapter 3), electrets integration with Microelectromechanical Systems (MEMS) with localized heater fabrication for wafer bonding and microcharging grids for in-situ charging using microcoronas (Chapter 4), and processing of MEMS transducers (Chapter 5).


Descriptors :   *MICROELECTROMECHANICAL SYSTEMS , ARMY AVIATION , ARRAYS , BONDING , DECOMPOSITION , DETECTORS , ELECTRETS , FABRICATION , FUZES(ORDNANCE) , GUIDED MISSILES , HEATERS , INTEGRATED SYSTEMS , SPECTRA , THESES , WAFERS


Subject Categories : Electrical and Electronic Equipment


Distribution Statement : APPROVED FOR PUBLIC RELEASE