Accession Number : ADA466178


Title :   Meso-Scale Self-Assembly Pilot Study


Descriptive Note : Final rept. 15 Jun-30 Dec 2006


Corporate Author : WASHINGTON UNIV SEATTLE DEPT OF ELECTRICAL ENGINEERING


Personal Author(s) : Parviz, Babak A


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/a466178.pdf


Report Date : 17 Apr 2007


Pagination or Media Count : 9


Abstract : The project investigates the formation of micro-scale structures using capillary force-driven self-assembly. Two main activities were undertaken during the course of the project: determination of the proper self-assembly environment and scaling of the metal contacts, and development of microfabrication processes that can generate micron-scale single crystal silicon parts that can participate in a self-assembly process. The effect of the alloy composition, chemical composition of the self-assembly environment, and contact metallization were extensively studied and an optimum condition for scaling the metal contacts was determined. Microfabrication processes on SOI wafers were developed to form parts that can participate in 2D and 3D self-assembly processes.


Descriptors :   *INTEGRATED CIRCUITS , *ALLOYS , *THREE DIMENSIONAL , *ASSEMBLY , FABRICATION , INTEGRATION , MICROMINIATURIZATION , SILICON ON INSULATOR


Subject Categories : Electrical and Electronic Equipment
      Metallurgy and Metallography


Distribution Statement : APPROVED FOR PUBLIC RELEASE