Accession Number : ADA457206


Title :   Thermomechanical Cycling Investigation of Cu and Niti Reinforced Lead-Free Solder


Descriptive Note : Master's thesis


Corporate Author : NAVAL POSTGRADUATE SCHOOL MONTEREY CA


Personal Author(s) : Horton, W S


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/a457206.pdf


Report Date : Sep 2006


Pagination or Media Count : 75


Abstract : In today,s Flip Chip (FC) and Ball Grid Array (BGA) electronic packages solder joints provide both the electrical as well as the mechanical connections between the silicon chip and the substrate. Due to coefficient of thermal expansion (CTE) differences between the chip and substrate the solder joints undergo thermomechanical stresses and strains as an electronic package is heated and cooled with power on/off cycles. Advances in chip designs result in chips that are larger, run hotter and demand improved resistance to creep and low-cycle fatigue in the solder joints. In this study the strengthening of these joints with two different reinforcements is explored: a hard particulate and a shape memory alloy (SMA) single fiber composite (SFC). A baseline is established with a SnAgCu solder that is then compared to test runs on the same solder matrix with Copper particles and then the SMA, Nickel- Titanium wire as reinforcements.


Descriptors :   *REINFORCING MATERIALS , *SOLDERED JOINTS , *LEAD(METAL) , THERMOMECHANICS , SILICON ALLOYS , TITANIUM ALLOYS , CHIPS(ELECTRONICS)


Subject Categories : Properties of Metals and Alloys


Distribution Statement : APPROVED FOR PUBLIC RELEASE