Accession Number : ADA268590


Title :   Low Dielectric Constant Insulators and Gold Metallization for GHz Multi-Chip Modules. Part 2


Descriptive Note : Annual Performance rept.,


Corporate Author : GEORGIA INST OF TECH ATLANTA


Personal Author(s) : Kohl, Paul ; Bidstrup, Sue A ; Hertling, David


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/a268590.pdf


Report Date : Jul 1993


Pagination or Media Count : 61


Abstract : The goal of this program is to investigate new dielectrics, metals and processes for the fabrication of multi-chip modules which hold the promise of exceptional electrical performance in the GHz region in addition to high yield and high reliability. The low dielectric constant insulators are being evaluated through the fabrication of in-situ test structures using noble metals. In the course of doing this evaluation, a simple process for gold or silver MCMs has been investigated. A processing scheme using noble metals (gold and silver) as the interconnection metallization in the module has been developed and is being characterized. The noble metal process has fewer process steps than the equivalent copper process and is potentially lower cost, particularly when high reliability is important. It has been observed that silver has an advantage in that it maintains its bulk conductivity during high temperature processing and has low residual stress.


Descriptors :   *DIELECTRICS , *CHIPS(ELECTRONICS) , *SILVER , *GOLD , *ELECTRICAL INSULATION , *METALLIZING , POLYMERS , FABRICATION , CONSTANTS , THERMAL CONDUCTIVITY , CIRCUIT INTERCONNECTIONS , RESIDUAL STRESS , COSTS , HIGH TEMPERATURE , ADHESION


Subject Categories : Inorganic Chemistry
      Electrical and Electronic Equipment
      Electricity and Magnetism
      Thermodynamics


Distribution Statement : APPROVED FOR PUBLIC RELEASE