Accession Number : ADA267316


Title :   Materials Processing and Manufacturing Technologies for Diamond Substrate Multichip Modules (DSMCM)


Descriptive Note : Technical summary,


Corporate Author : COLORADO STATE UNIV FORT COLLINS DEPT OF CHEMICAL ENGINEERING


Personal Author(s) : Dandy, David S


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/a267316.pdf


Report Date : 01 Jul 1993


Pagination or Media Count : 6


Abstract : A detailed surface kinetics mechanism has been developed for the deposition of CH3, C2H2, and C onto a reconstructed (100) diamond surface. The mechanism accounts for the growth of alternating dimer-trough rows. The thermophysical properties of all structures present in the mechanism have been computed using the molecular mechanics program MM3 (92). A diamond growth mechanism on the unreconstructed (100) surface has been used in a stagnation flow model to examine the effect of hydrocarbon injector location and inlet temperature on gas-phase species distributions and diamond growth rate in a DC arcjet reactor system typical of that in use at the Norton Company. It is predicted that there is an optimal injectors location, dictated by operating conditions, that results in maximum concentrations of reactive growth species CH(x), and consequently, in maximum diamond growth rate


Descriptors :   *CHIPS(ELECTRONICS) , *DIAMONDS , *HYDROCARBONS , *SUBSTRATES , *MODULES(ELECTRONICS) , TEMPERATURE , MANUFACTURING , PHASE , SURFACES , THERMOPHYSICAL PROPERTIES , ELECTRIC ARCS , DIMERS , DIRECT CURRENT , INJECTORS , KINETICS , MOLECULAR STRUCTURE , DEPOSITION , MECHANICS , GASES , COMPUTERS , THERMODYNAMICS , MATERIALS , PROCESSING


Subject Categories : Inorganic Chemistry
      Organic Chemistry
      Physical Chemistry
      Thermodynamics


Distribution Statement : APPROVED FOR PUBLIC RELEASE