Accession Number : ADA267053


Title :   Reliability Characterization of Digital Microcircuits - Investigation of an In-Process Oxide Reliability Screening Method


Descriptive Note : Final rept. Jan 91-Nov 92,


Corporate Author : DESERET TEST CENTER DUGWAY PROVING GROUND UT CHEMICAL DIV


Personal Author(s) : Wu, Chung P


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/a267053.pdf


Report Date : Apr 1993


Pagination or Media Count : 115


Abstract : This report covers the work performed, using a sacrificial-metal- pattern technique, to demonstrate a 100% in-process screen for oxide defects in high-density CMOS microcircuits, and to evaluate the effectiveness and side effects of the added processing steps on yield and reliability. Using large-area polysilicon capacitors and 101-stage metal-1 delay-lines in GEM WAT keys as test vehicles, experiments with split lot reliability screening and life test, first with 240 A and again with 150 A gate oxide, have demonstrated practically complete elimination of the defective populations for test capacitors and about 50% reduction in circuit functionality failures for delay-line circuits. This is accomplished with little or no penalty in metal-polysilicon contact resistance, or in delay-line circuit yield. The technique is found to be promising and should be further investigated with more complex circuits with double-level metals.... Oxide reliability, In-process screening effects, Voltage ramp oxide breakdown, Time-dependent dielectric breakdown, CMOS, CMOS-on-insulator, Integrated Circuits.


Descriptors :   *INTEGRATED CIRCUITS , *RELIABILITY , *MICROCIRCUITS , TEST AND EVALUATION , METALS , DENSITY , MONITORING , PROCESSING , POPULATION , HIGH DENSITY , FAILURE(ELECTRONICS) , DELAY LINES , CAPACITORS , POLYSILICONS , ELIMINATION , LIFE TESTS , LIFE CYCLES , CIRCUITS , PATTERNS , DEFECT ANALYSIS , OXIDES , REDUCTION , INSULATION , RESISTANCE , DIELECTRICS , FAILURE , VOLTAGE


Subject Categories : Electrical and Electronic Equipment


Distribution Statement : APPROVED FOR PUBLIC RELEASE