Accession Number : ADA266968


Title :   Multichip Module High Speed Testing


Descriptive Note : Quarterly rept. 1 Apr-30 Jun 93,


Corporate Author : COLUMBIA UNIV NEW YORK DEPT OF ELECTRICAL ENGINEERING


Personal Author(s) : Davis, Robert J ; Auston, David H


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/a266968.pdf


Report Date : 30 Jun 1993


Pagination or Media Count : 3


Abstract : Progress in the testing of multichip module electronic circuit packages for the period April 1, 1993 - June 30, 1993 is described below, in the areas of the testing of multichip modules using electrooptic polymers, the testing of high-speed transmission line structures, and the microfabrication of fiber optic test probes.


Descriptors :   *CHIPS(ELECTRONICS) , ELECTROOPTICS , POLYMERS , COPOLYMERS , MODULES(ELECTRONICS) , TRANSMISSION LINES , FABRICATION , SIGNAL TO NOISE RATIO


Subject Categories : Electrical and Electronic Equipment


Distribution Statement : APPROVED FOR PUBLIC RELEASE