Accession Number : ADA266066


Title :   RF Vacuum Microelectronics


Descriptive Note : Quarterly technical rept. no. 4, 1 Jan-31 Mar 1993


Corporate Author : HUGHES AIRCRAFT CO TORRANCE CA ELECTRON DYNAMICS DIV


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/a266066.pdf


Report Date : 31 Mar 1993


Pagination or Media Count : 14


Abstract : All layers of mask set 2 were received prior to Feb. 1. A photograph of the overall reticle layout is shown in figure 1. There are 16 reticles per 1 in. wafer and 9 different chips per reticle for a total of 149 chips of which about 120 are expected to be usable (about 30 chips are too close to the wafer edge). On this mask set we concentrated on straightforward arrays of tips of different sizes oriented in such a way that they could be conveniently package onto TO-8 headers. In the previous experiments we found the most significant impediment to consistency in testing was the bonding, die-attach and packaging.


Descriptors :   *MICROELECTRONICS , EMISSION , OPTIMIZATION , MASKS , VACUUM


Subject Categories : Electrical and Electronic Equipment


Distribution Statement : APPROVED FOR PUBLIC RELEASE