Accession Number : ADA264627


Title :   On the Ideality of Using a Step-Function Current in a Metallic Foil to Simulate a Step-Function Heat-Flux Source


Descriptive Note : Final rept. Jan-Feb 1992


Corporate Author : ARMY RESEARCH LAB ABERDEEN PROVING GROUND MD


Personal Author(s) : Miller, Martin S


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/a264627.pdf


Report Date : May 1993


Pagination or Media Count : 30


Abstract : An exact solution is derived to the one-dimensional, time-dependent, heat-conduction equation for a two-layer, semi-infinite, composite solid with sudden uniform heat generation in the surface layer, no heat transfer through the surface plane, and uniform initial temperature. The interface between the two layers is assumed to have no thermal contact resistance. This solution enables a discussion of the ideality with which a step-function electric current in a metallic foil can generate a step-function heat flux into a contacting semi-infinite solid. Previous measurements of thermal diffusivity (based on the above conditions) have relied on the idealized constant-flux solution for data reduction. It is shown here that the temperature errors in the substrate arising from non-ideality of the constant-flux boundary condition increase with depth into the substrate, foil thickness, and decreasing thermal conductivity/ diffusivity of the substrate.... Thermal diffusivity, Transient heat conduction, Metal foil, Heat flux, Laplace transform, Thermal diffusion.


Descriptors :   *ELECTRIC CURRENT , *FOILS(MATERIALS) , *HEAT FLUX , *METALS , BOUNDARIES , COMPOSITE MATERIALS , CONSTANTS , DATA REDUCTION , DIFFUSIVITY , EQUATIONS , ERRORS , FUNCTIONS , HEAT TRANSFER , INTERFACES , LAPLACE TRANSFORMATION , LAYERS , MEASUREMENT , ONE DIMENSIONAL , RESISTANCE , SIMULATION , SOLIDS , SUBSTRATES , SURFACES , TEMPERATURE , THERMAL CONDUCTIVITY , THERMAL DIFFUSION , THICKNESS , TRANSFER , TRANSIENTS


Subject Categories : Physical Chemistry
      Electricity and Magnetism
      Thermodynamics


Distribution Statement : APPROVED FOR PUBLIC RELEASE