Accession Number : ADA262809


Title :   Fabrication Techniques and Technologies for Missile Seeker Microelectronic Components (Focusing on Multi-Chip Module Substrate Reliability)


Descriptive Note : Final technical rept. 15 Jul 1991-30 Sep 1992


Corporate Author : GEORGIA TECH RESEARCH INST ATLANTA


Personal Author(s) : Livesay, B R ; Bohlander, R A ; Turbini, L J ; Schodorf, J B


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/a262809.pdf


Report Date : Nov 1992


Pagination or Media Count : 93


Abstract : This report reviews recent multi-chip module (MCM) manufacturing technology developments. MCMs represent an emerging technology which will provide the Army with high-speed processors for missile seekers in a more compact form than offered by previous generations of electronic packaging. Both ceramic (MCM-C) and deposited dielectric (MCM-D) forms are covered, including those incorporating polyimide and new polymer films. Includes literature review of recent manufacturing processes, necessary generic equipment under development and in current practice. Promising developments include low-temperature cofired ceramics, polymer dielectrics with low water absorptivity, new photo-definable polymers, new adhesion promoters, gold thin-film metallization methods, laser ablation of vias, and controlled polymer precursors extrusion. Reliability issues are emphasized in the review, particularly in respect of the severe environmental conditions experienced by missiles, and a detailed review of mechanisms of degradation is included. Recommendations are made on the need for micromechanical and electrical property measurements of candidate MCM materials.


Descriptors :   *MANUFACTURING , *FABRICATION , *MICROELECTRONICS , *GUIDED MISSILE DETECTION , *GUIDED MISSILE COMPONENTS , STRESSES , MILITARY REQUIREMENTS , POLYMERS , INTEGRATED CIRCUITS , CERAMIC MATERIALS , SILICON , THICK FILMS , MICROCIRCUITS , HYBRID SYSTEMS , MODULES(ELECTRONICS) , POLYMERIC FILMS , RELIABILITY , METAL OXIDE SEMICONDUCTORS , CHIPS(ELECTRONICS) , THIN FILMS , ELECTROOPTICS , INTEGRATED SYSTEMS


Subject Categories : Electrical and Electronic Equipment
      Ceramics, Refractories and Glass
      Mfg & Industrial Eng & Control of Product Sys


Distribution Statement : APPROVED FOR PUBLIC RELEASE